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3D Microelectronic Packaging From Architectures to Applications

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   Author: Baturi   |   24 August 2021   |   : 0

3D Microelectronic Packaging: From Architectures to Applications by Yan Li
English | EPUB | 2021 | 629 Pages | ISBN : 9811570892 | 214.5 MB
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

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