ANSYS Electronics Suite 2021 R1

General Electronics Desktop
- Commercial release of Mechanical and EMIT design types
- Ansys Cloud enhancements:
. Multi-step job submission
. Auto extraction o freport data
. Improved robustness and useability
- AbilitytoeditdesignsettingsinthePropertieswindow
- Enhanced Minerva integration, including direct project access
- Integration of optiSlang setup in Optimetrics (Beta, Windows only)
- New 3Dmodeler orientation gadget
- Support for Linux SLURMschedulers
- Automatic use of loopback address to improve reliability when connecting and disconnecting with VPN
- Ability to schedule, submit, and monitor jobs in standalone utility
- New menu command to validate parametric setups before solving
- Enhanced useability and workflows in Network Data Explorer
- Proxy3D Components (Beta)
- Enhancements to object-oriented property scripting (Beta)
HFSS
- Performance improvements:
. Improved iterative solver
. Improved performance for designs with many sources
. Ability to disable saving adaptive pass refinement files
- Improvements for SBR+ designs:
. Ability to visualize link source geometry in the target design
. Support for composite sources
. Features for automotive radar:
.. Parametric antenna arrays
.. FMCW in Range-Doppler solutions
. Enhancements to near field excitations and post-processing
. Linked antenna array source blockage in hybrid simulations
- FEM3D components mesh assembly (Beta)
- New automatic airbox region for 3Dcomponent arrays
- Embedded element pattern export
- Single-sided shell element field Descriptionting
- Azimuth,elevation,andslantanglesfor far fields
- Finite Array Toolkit enhancements for amplitude tapering and sub-arrays
- Support for dispersive ports in the hybrid transient solver
- Option to prevent mesh-method fallback
- Option to suppress gamma, Zo in automatic S Parameter export
HFSS 3D Layout
- Performance improvements:
. Improved iterative solver
. Improved performance for designs with many ports
. Ability to disable saving adaptive pass refinement files
- Support for encrypted 3D components
- Q3DDCpointfor designs with 3Dcomponents
- FEM3Dcomponents mesh assembly
- Improved dialog box for wirebond creation and editing
- Improvements to IC-mode meshing
- Support for package definitions and IDF
- Support for unencrypted iRCX technology in GDS import
SIwave
- Support for Granta material libraries
- Improved SYZ solver performance for designs with a very large number of ports
- New time-domain crosstalk scan for differential nets
- New integrated DDR wizard (Beta)
- Improved robustness of RLCG extraction
- Improved handling of CPM and Voltus models
- Option to visualize direction of incident waves
- Ability to specify location of capacitor and IBISlibrary directories
- Ability to run Icepak simulations from the Electronics installation
Maxwell
- Commercial release of new A-Phi transient solver
- Commercial release of partial mesh and solution from full rotational model
- Support for temperature-dependent core loss curves
- Support for spatially-varying materials characteristics and temperatures from XYZ datasets
- Extension of Litz wire modeling to RL matrix solutions
- Ability to create field Descriptions of average loss
- Ability to parameterize adaptive frequency in eddy current solutions
- Enhancements to electric machine toolkit workflows and performance
- Ability to output transient electromagnetic forces to motion
- Support for element-based volumetric harmonic forc eineddy-current solutions
- Support for GPU acceleration in 3D real matrix solutions
- Ability tos pecify minimum and maximum nonlinear iterations
- Support for time-dependent excitations and motion in system coupling
- New 3D AC conduction solver (Beta)
Motor-CAD
- Export Maxwell (2D/3D) custom DXF geometry
- Using Maxwell User-Defined Primitive for hairpin coil definition with parametrized elements
- Optimization ratio-based geometry
- Force analysis improvements
- Use Maxwell solver as an electromagnetic option for driving cycle analysis
- Thermal end-winding modeling improvement
Icepak
- New ability to generate LTI ROM models in Twin Builder
- New flow links and improved workflows for network schematics
- Improved meshing automation and workflows
- Enhancements to concurrent meshing of regions
- Ability to import IDF datat hrough PCB components
- New fast Optimetrics option to copy meshes and solver inputs
- Ability to scale EM losses
- Ability to include dielectric loss in links from 3D Layout
- New ability to export solver monitor and residual data
- New dynamic thermal managements control (Beta)
Mechanical
- First commercial release in Electronics Desktop
- Fully integrated workflows and solutions on Windows and Linux
- Ability to set up and solvet hermal and modal simulations
- EM loss coupling with HFSS, Maxwell, and Q3D Extractor
- Rotating fluid boundary for electric machines
- Ability to link with heat transfer coefficient calculated in Icepak
Q3D Extractor
- CommercialreleaseofAnsysPRIME meshoptionfor CGsolver
- ImprovedperformanceofCGdirectsolver
- New uniformcurrentcircuitterminalsfor theAC-RLsolver (Beta)
Circuit
- Integration of Power Module Characterization Tool in Circuit designs
- Enhanced efficiency of dynamic links to field solvers
- AMI model support for single-ended devices
- Addition of parasitic elements to L and C models
- New support for eye measurements in countour Descriptions
- Integration of SPISim SPro functionality into Network Data Explorer
- AdditionofNexximasdefaultsimulator for SPISim
- New SPISim COM capabilities, including PowerSum, Effective Return Loss (ERL)
- Improved DC passivity preservation in state-space fitting (Beta)
EMIT
- First commercial release in Electronics Desktop
- Improved coupling link with HFSS and HFSS 3D Layout
- Enhancements to workflows and usability of schematic editor
- Improved automation and scripting API
- Support for import of projects from classic EMIT
Twin Builder
Modelica Workflow Enhancements
- Support for Modelica package creation and library management
- Support to extend existing Modelica model
- Enhanced support for graphical annotation
- Faster loading of Modelica libraries and numerous other Modelica usability enhancements
Enhancements to ROMs and ROMViewer
- Support for Fields Visualization in Dynamic ROM Builder
- Static ROM Builder supports geometrical parameter variation
- New Response Surface ROM Toolkit
- UI for Linear Parameter Varying (LPV) ROM
- Enhancements to the Static ROM Viewer
- Support for 3D Visualization during Simulation inside Twin Builder
Battery and EV Verticalization
- Toolkit to perform Failure Mode & Effect Analysis (FMEA)
- Motor Equivalent Circuit Toolkit for FMU export
- Battery Wizard improvement
- New EV Powertrain Library
- Toshiba component library as ACT extension
Export,Deployment, and Digital Twins
- Support for Schematic authoring, Python block, and simulation result explorer in Twin Deployer
- Export Twin project for sample deployment and DTDL for Microsoft Azure Digital Twin deployment
- Enhanced interoperability with all-inclusive Tool-coupling FMU
- Support for FMU (fixed step) export from Simulink for Twin Builder
- Improved compilation of FMUs and Twin Builder Fluent component on Linux
- Improved UI for adaptor for flsim in Fluent
Support for Enterprise Workflow
- Ansys Minerva integration in Twin Builder
- Ansys optiSLang integration in Twin Builder
General
- NumerousUseability and Performance Enhancements
For complete details on the new features of Ansys Electronics 2021 R1 please refer to the


ANSYS Electronics Desktop is a comprehensive platform that enables electrical engineers to design and simulate various electrical, electronic and electromagnetic components, devices and systems. It is a unified interface which creates and analyzes electromagnetic (EM), thermal and circuit designs.
Engineers can access gold-standard tools such as ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor and ANSYS Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, the Electronics Desktop includes direct links to the full ANSYS portfolio of thermal, fluid and mechanical solvers for comprehensive multiphysics analyses.
Engineers can integrate rigorous 2D and 3D physics analyses with system and circuit simulations, all inside a single framework called ANSYS Electronics Desktop. Any combination of products within the Electronics Desktop can be inserted into a single project. For instance, you can combine disparate design types such as HFSS, Circuit and Icepak into a single project. Schematics can be used to wire up different field solver models and create a model of a high-level system through dynamic links that combine 3D EM and SPICE circuit analyses.
Engineers can efficiently manage complex projects that require several different analysis tools to predict the operation of their electronic products. Designs can also be parameterized. With Optimetrics, design variations can be studied and made available to other modules when the designs are included in a higher-level simulation. This allows engineers to conduct what-if experiments and study the effects of component design parameter variations on the behavior of the entire system.
Ansys Electronics Suite 2021 R2, sneak peak.






Founded in 1970, ANSYS employs nearly 3,000 professionals, many of whom are expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our exceptional staff is passionate about pushing the limits of world-class simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost. As a measure of our success in attaining these goals, ANSYS has been recognized as one of the world's most innovative companies by prestigious publications such as Bloomberg Businessweek and FORTUNE magazines.
Product: ANSYS Electronics
Version: 2021 R1 Suite
Supported Architectures: x64
Website Home Page : www.ansys.com
Language: english
System Requirements: PC *
Size: 13.8 Gb


Platform Support
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